Jobs › US jobs › Packaging Engineer- Bump Interconnect
Volantis Semiconductor, Inc. · Hybrid Remote/SF Bay Area/Austin/Boston
We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement, reliability, failure analysis, and cross-functional support through package and system productization.
Read the full advert and apply on Volantis Semiconductor, Inc.'s site →
Collected from Volantis Semiconductor, Inc.'s own careers site (Greenhouse). Posted 23 Jul 2026. TUNAI shows an excerpt and the facts it read from the advert; the employer's page has the full description and the application.
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