Jobs › US jobs › Packaging Engineer- Flip Chip
Volantis Semiconductor, Inc. · Hybrid Remote/SF Bay Area/Austin/Boston
We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and system productization.
Read the full advert and apply on Volantis Semiconductor, Inc.'s site →
Collected from Volantis Semiconductor, Inc.'s own careers site (Greenhouse). Posted 24 Jul 2026. TUNAI shows an excerpt and the facts it read from the advert; the employer's page has the full description and the application.
Does your CV match this job? Paste both and see exactly which of these skills it shows.
Check my CV against this job →