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Volantis Semiconductor, Inc. · Hybrid Remote/SF Bay Area/Austin/Boston
We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced engineer to lead wafer level mold and underfill process development for advanced semiconductor packages (fan-out wafer level packaging, 2.5D/3D, chiplet).
Read the full advert and apply on Volantis Semiconductor, Inc.'s site →
Collected from Volantis Semiconductor, Inc.'s own careers site (Greenhouse). Posted 24 Jul 2026. TUNAI shows an excerpt and the facts it read from the advert; the employer's page has the full description and the application.
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