Job Details: Job Description: Intel’s Wafer Packaging Manufacturing organization supports semiconductor wafer processing, testing, and die-to-wafer assembly. We are seeking two ORAP (Oregon Advanced Packaging) Integration Yield Technicians to provide manufacturing sustaining and engineering development support across HBI, WLA, Die Prep, and TSVr.
Read the full advert and apply on Intel's site →
Collected from Intel's own careers site (Workday). Posted 28 Sep 2026. TUNAI shows an excerpt and the facts it read from the advert; the employer's page has the full description and the application.